To Make a Negative Resist PCB, you have to Place the substrate onto the spin-coater chuck. Using a pipette, you need to place enough SU8 2002 resist onto the substrate to completely cover it. You must Program the spin-coater to spin at 500 rpm for ten seconds and 2000 rpm for thirty seconds. After that, remove the sample from the spin-coater. You should place it on a hot plate set to 95 degrees Celsius or 203 degrees Fahrenheit. You can leave the sample on the hot plate for two minutes. You have to Remove sample and allow it to cool for five minutes. Then, Place the photo-mask into the mask aligner.
You need to Place the sample under the mask. You must expose the sample. You should remove the sample from the mask aligner. You can place it into a beaker of developer for one minute. After development, you have to rinse sample in Isopropyl alcohol. Next, Place a pellet of copper into the evaporation chamber crucible. You need to Pump down the evaporation chamber to a pressure of about 10^-6 mbar or 10^-4 Pascals. You must Deposit the desired thickness of copper. You should remove the sample from the evaporator. You can Place the sample into a beaker of acetone. You have to Rinse the sample in a beaker of IPA.